Formic acid

Formic acid is an additive for coatings and a neutralization agent (i.e. cationic electro deposition paints). Formic acid is used in resin production for CED-resins.

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3-(Cyclohexylamino) propylamine

3-(Cyclohexylamino) propylamine is a cross linker for epoxy resins. 3-Cyclohexylaminopropylamine is suitable for two-component epoxy coatings and for epoxy-based plastic parts. 3-Cyclohexylaminopropylamine is very compatible with co-resins and improves resistance against humidity during film formation.

3-(Dimethylamino) propylamine

3-(Dimethylamino) propylamine is a building block for modification of epoxy resins. 3-(Dimethylamino) propylamine modified epoxy resins are used for cationic electro deposition coatings.

3,3'-Dimethyl-4,4'-diamino-dicyclohexyl-methan

3,3'-Dimethyl-4,4'-diamino-dicyclohexyl-methan is a cross linker for epoxy resins, building block for polyamides and polyurethanes. 2,2'-Dimethyl-4,4'-methylene bis(cyclohexylamine)is suitable for two-component epoxy coatings, for epoxy-based adhesives and epoxy composites. The hydrophobic structure of 2,2'-Dimethyl-4,4'-methylene bis(cyclohexylamine) improves the hydrolytical resistance, increases reactivity and compatibility in epoxy coatings.

4-Hydroxybutyl vinyl ether (HBVE)

4-Hydroxybutyl vinyl ether (HBVE) is a building block for macro monomers and monomer for vinyl copolymers, reactive diluents for UV coatings. Ethoxylatated HBVE is used as a monomer for concrete additive. Used for water and solvent based hydroxyfunctional vinyl polymers, which are cross-linked with polyisocyanates and melamine resins.