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TEGOPAC® Bond 150 ingredient sample

Adhesives & Sealants

TEGOPAC® Bond 150

Evonik Operations GmbH, BL Silanes

TEGOPAC® Bond 150 is recommended for usage as a binder in assembly adhesives and sealant formulations. The combination of outstanding through-cure and excellent elastic recovery properties allows formulations with TEGOPAC® Bond 150 to be used in a number of demanding applications, e.g. in construction of sandwich elements, for flexible bonding in transport applications or for high quality expansion joints.

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DYNASYLAN® 1146

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Dynasylan® 40

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