Synpol 160

Synpol 160 is a reactive polyamide resin. This product has a density at 25°C of 0.94-0.96 g/cm3. Synpol 160 is most commonly used as a hardener in solvent-free coating, adhesive, and lamination applications.

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D.M.P. 30

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Epoxy Phenol B.G.E.

Epoxy Phenol B.G.E. is a reactive diluent. This product has a density of 0.92-0.94 g/cm3. Epoxy Phenol B.G.E. is most commonly used in casting, encapsulation, and bonding applications.

Epoxy Phenol CNSL

Epoxy Phenol CNSL is a reactive diluent. This product has a density of 0.96-0.97 g/cm3. Epoxy Phenol CNSL is most commonly used in casting, encapsulation, and bonding applications.

Epoxy Phenol P.G.E.

Epoxy Phenol P.G.E. is a reactive diluent. This product has a density of 1.11-1.22 g/cm3. Epoxy Phenol P.G.E. is most commonly used in casting, encapsulation, and bonding applications.