Epoxy Phenol B.G.E.

Epoxy Phenol B.G.E. is a reactive diluent. This product has a density of 0.92-0.94 g/cm3. Epoxy Phenol B.G.E. is most commonly used in casting, encapsulation, and bonding applications.

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D.M.P. 30

D.M.P. 30 is a tertiary amine. This product has a viscosity of 2-5 cPs and a density of 0.9-1.0 g/cm3. D.M.P. 30 is most commonly used as a hardener in lamination and adhesive applications.

Epoxy Phenol CNSL

Epoxy Phenol CNSL is a reactive diluent. This product has a density of 0.96-0.97 g/cm3. Epoxy Phenol CNSL is most commonly used in casting, encapsulation, and bonding applications.

Epoxy Phenol P.G.E.

Epoxy Phenol P.G.E. is a reactive diluent. This product has a density of 1.11-1.22 g/cm3. Epoxy Phenol P.G.E. is most commonly used in casting, encapsulation, and bonding applications.

Hardeners 111 is an aliphatic polyamine. This product has a viscosity of 15-25 cPs and a density of 0.98-0.99 g/cm3. Hardeners 111 is most commonly used in adhesive and coal tar modified surface coating applications.