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Graphic Arts & Inks
HX-5440, in the form of a white emulsion, is a hydrophobic modified alkali-active acrylate copolymer. This product is an associative rheological thickener that can be used in latex paints, water-based coatings, inks, and binders. It can associate with surfactants, polymers, pigments and fillers in water-based systems, in order to increase film thickness. It can also prevent a coating from splashing and dripping while providing the coating flowing and leveling properties. This product is dispersible in water.
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HX-2080, in the form of an emulsion, is a defoaming polysiloxane solution. This product can be used in solvent-based coatings, solvent-free coatings, UV-curable coatings, and solvent-based inks. It can eliminate and depress blisters created during the production, packaging, and application process. It is suitable for inks in screen printing.
HX-2085, in the form of an emulsion, is a defoaming polysiloxane solution. This product can be used in solvent-based coatings, solvent-free coatings, UV-curable coatings, and solvent-based inks. It can eliminate and depress blisters created during the production, packaging, and application process. This product is suitable for high-viscosity, high solids, and solvent-free systems like epoxy flooring applications, antiseptic coatings, and electronic encapsulations.
HX-2086, in the form of an emulsion, is a defoaming polysiloxane solution. This product can be used in solvent-based coatings, solvent-free coatings, UV-curable coatings, and solvent-based inks. It can eliminate and depress blisters created during the production, packaging, and application process. It is suitable for inks in screen printing.
HX-2090, in the form of an emulsion, is a defoaming polysiloxane solution. This product can be used in solvent-based coatings, solvent-free coatings, UV-curable coatings, and solvent-based inks. It can eliminate and depress blisters created during the production, packaging, and application process. This product is suitable for high-viscosity, high solids, and solvent-free systems like epoxy flooring applications, antiseptic coatings, and electronic encapsulations.