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Graphic Arts & Inks
HX-4013, in the form of a brown viscous liquid, is a low-molecular weight fatty amine. This product can be used in solvent-based coatings, solvent-free coatings, and in solvent-based inks. It is a dispersant that can increase dispersion effectiveness, reduce system viscosity, increase color spread, and maintain storage stability. This product is soluble in aromatic solvents, fatty solvents, and solvents that contain oxygen.
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HX-2080, in the form of an emulsion, is a defoaming polysiloxane solution. This product can be used in solvent-based coatings, solvent-free coatings, UV-curable coatings, and solvent-based inks. It can eliminate and depress blisters created during the production, packaging, and application process. It is suitable for inks in screen printing.
HX-2085, in the form of an emulsion, is a defoaming polysiloxane solution. This product can be used in solvent-based coatings, solvent-free coatings, UV-curable coatings, and solvent-based inks. It can eliminate and depress blisters created during the production, packaging, and application process. This product is suitable for high-viscosity, high solids, and solvent-free systems like epoxy flooring applications, antiseptic coatings, and electronic encapsulations.
HX-2086, in the form of an emulsion, is a defoaming polysiloxane solution. This product can be used in solvent-based coatings, solvent-free coatings, UV-curable coatings, and solvent-based inks. It can eliminate and depress blisters created during the production, packaging, and application process. It is suitable for inks in screen printing.
HX-2090, in the form of an emulsion, is a defoaming polysiloxane solution. This product can be used in solvent-based coatings, solvent-free coatings, UV-curable coatings, and solvent-based inks. It can eliminate and depress blisters created during the production, packaging, and application process. This product is suitable for high-viscosity, high solids, and solvent-free systems like epoxy flooring applications, antiseptic coatings, and electronic encapsulations.