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Epoxy Phenol CNSL
Epoxy Phenol CNSL is a reactive diluent. This product has a density of 0.96-0.97 g/cm3. Epoxy Phenol CNSL is most commonly used in casting, encapsulation, and bonding applications.
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Synpol Products PVT. Ltd publishes documents in the marked regions.
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Synpol Products PVT. Ltd lists this grade in the Chemicals DB directory.
Also from Synpol Products PVT. Ltd
D.M.P. 30
D.M.P. 30 is a tertiary amine. This product has a viscosity of 2-5 cPs and a density of 0.9-1.0 g/cm3. D.M.P. 30 is most commonly used as a hardener in lamination and adhesive applications.
Epoxy Phenol B.G.E.
Epoxy Phenol B.G.E. is a reactive diluent. This product has a density of 0.92-0.94 g/cm3. Epoxy Phenol B.G.E. is most commonly used in casting, encapsulation, and bonding applications.
Epoxy Phenol P.G.E.
Epoxy Phenol P.G.E. is a reactive diluent. This product has a density of 1.11-1.22 g/cm3. Epoxy Phenol P.G.E. is most commonly used in casting, encapsulation, and bonding applications.
