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Adhesives & Sealants
Evonik Operations GmbH, BL Crosslinkers
Evonik Operations GmbH, BL Crosslinkers lists 32 grades in Adhesives & Sealants. The sheets saved on this site are below.
Grades from Evonik Operations GmbH, BL Crosslinkers
EPODIL® 742
An epoxy resin system modifier.
EPODIL® 748 REACTIVE DILUENT
General-purpose diluent. Low toxicity and low vapor pressure. Slows reactivity. Good viscosity reduction, improves flexibility, and improves adhesion to no-polar surfaces.
EPODIL® 749 REACTIVE DILUENT
Low volatility diluent. Low reduction in physical properties and reactivity. Used in civil engineering applications, electrical potting, and encapsulation.
EPODIL® 759 Reactive Diluent
EPODIL® 759 Reactive Diluent is an aliphatic glycidyl ether (C12– C13). The product is a monofunctional reactive diluent used to reduce the viscosity of epoxy resin systems. Since monofunctional diluents, in general, cause molecular weight chain termination, the minimum amount necessary to achieve the desired viscosity reduction should be used.
EPODIL® LV5 DILUENT
Epodil LV5 diluent is a chemically inert, low viscosity liquid hydrocarbon resin. It is soluble in and compatible with a wide variety of epoxy resins as well as most curing agents.
HYBRIDUR® 580 Polymer Dispersion
HYBRIDUR® 580 Polymer Dispersion is an acrylic-urethane hybrid polymer dispersion. Cost-effective alternative to standard polyurethane dispersions. Provides outstanding adhesion to a wide variety of substrates, superior abrasion, and chemical and stain resistance.
IMICURE® AMI-1 Curing Agent
IMICURE® AMI-1 Curing Agent is a liquid, elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1-5 phr. It is ideal for use in adhesives, pre-preg composites, and encapsulation.
IMICURE® AMI-2T Curing Agent
IMICURE® AMI-2T Curing Agent is an elevated temperature curing agent for epoxy systems. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1-5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents. It is ideal for use in electrical laminates, adhesives, pre-preg composites, and encapsulation.
IMICURE® EMI-24 Curing Agent
IMICURE® EMI-24 Curing Agent is a high-reactivity, medium-viscosity liquid imidazole used alone or to accelerate dicyandiamide or anhydride cures. Used in filament winding, electrical laminates, molding powders, one-component adhesives, and structural adhesives.
IMICURE® Imidazole Curing Agent
IMICURE® Imidazole Curing Agent is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy resins, and because it is a catalytic curing agent, it is used at low loadings of 1-5 phr. It is a good accelerator for dicyandiamide, anhydride and phenolic curing agents.
Amicure® CG-NA Curing Agent
Amicure® CG-NA Curing Agent is an unpulverized grade of dicyandiamide designed for use as a latent curing agent for epoxy resins in solventbased processes. It is ideal for use in electrical laminates, and solvent-based, pre-preg composites.
AMICURE® UR Curing Agent
AMICURE® UR Curing Agent is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamide- cured epoxy resins. It combines excellent latency at ambient temperature with rapid cure in systems heated above its activation temperature. It is ideal for use in one-pack paste and film adhesives, heat-sure composites, and prepreg composites.
Ancamide® 220 Curing Agent
Ancamide® 220 Curing Agent is one in a series of standard reactive polyamides for use in the curing of epoxy resins. It has been designed particularly for use in solvent-based surface coatings.
ANCAMIDE® 220-X-70 Curing Agent
ANCAMIDE® 220-X-70 Curing Agent is one in a series of standard reactive polyamides intended for use in the curing of epoxy resins. It is ideal for use in solvent-based maintenance coatings, primers, sealers and coatings for concrete.
ANCAMIDE 221® Curing Agent
ANCAMIDE 221® Curing Agent is a member of a series of reactive polyamides developed for use in the curing of epoxy resins in solvent-based surface coatings applications. Special features include good color, color stability, chemical resistance and excellent corrosion resistance properties. It is freely compatible with a wide range of solvents, including those generally used in epoxy resin based coatings.
ANCAMIDE® 3201 Curing Agent
ANCAMIDE® 3201 Curing Agent is a low viscosity, solvent-free formulated polyaminoamide adduct. The curing agent is an accelerated version of Ancamine® 3200 and is recommended for use with liquid epoxy resin for the development of primers, coatings particularly for wet and high humid application areas. In addition the curing agent can be used for high-solid coatings for corrosion protection under severe conditions.
ANCAMIDE® 400 Curing Agent
ANCAMIDE® 400 Curing Agent is a unique, low viscosity reactive polyamide developed specifically for use in the curing of liquid epoxy resins. It can be used in a wide range of applications, including flooring and surface coatings, adhesives, sealant and putties, castings, laminates, and cable jointing compounds.
Ancamide® 910
Ancamide® 910 curing agent is a versatile, flexible hardener designed for use with liquid epoxy resin. Its engineered chemistry provides a unique combination of properties not found in other epoxy hardeners. It delivers outstanding flexibility/peel strength, excellent thermal shock resistance, and good electrical properties. Additional features include lower viscosity than conventional polyamides and DOT non-corrosive status. Ancamide® 910 curing agent can be used either as a sole curing agent or as a modifier.
Ancamine® 2014AS/FG
Ancamine® 2014AS/FG is a modified aliphatic polyamine adduct designed for use as a latent catalyst and curing agent for liquid epoxy resins. They can also be used as accelerators for dicyandiamide (DICY). This white micronised powder is applied in one-component adhesives and solvent free laminating.
Ancamine® 2337S
Ancamine® 2337S curing agent is a modified aliphatic amine designed for use as a latent curing agent for epoxy resins. Applications for this product include one-component conduction or induction heat-cure adhesives, potting, coatings, and hot-melt prepregs. This product is a light yellow powder.
Ancamine® 2442 Curing Agent
Ancamine® 2442 curing agent is a modified polyamine designed for use as a latent curing agent for one-component epoxy formulations. The product can also be used to accelerate dicyandiamide (DICY). It provides an excellent balance of low-temperature activation, good shelf stability and high glass transition temperature, and can be used in many applications requiring latency and high performance.
ANCAREZ® AR555 Waterborne Epoxy Resin
ANCAREZ® AR555 Waterborne Epoxy Resin is a waterborne solid epoxy resin dispersion delivered at 55% solids in water. It is designed for use in two-component, ambient-cure epoxy systems. It delivers superior performance at lower cost when compared to conventional solid resin dispersions. The unique nature of this product allows film formulation without high levels of coalescing solvent, which enables the formulation of low-odor, zero-VOC systems.
NOURYBOND® 289 Adhesion Promoter
NOURYBOND® 289 Adhesion Promoter is a blocked isocyanate PVC plastisol adhesion promoter for use in automotive sealants applied to visible areas and anti-chip primers.
VESTALITE® S 101
VESTALITE® S 101 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 101 have a low initial viscosity during compounding, allowing excellent fiber wetting, highfiber volume fraction and efficient processing. The high reactivity of the hardener allows fast curing inabout 4 - 5 min at 150 °.
VESTALITE® S 102
VESTALITE® S 102 is a curing agent for epoxy resin matrix designed for SMC applications. Systems using VESTALITE® S 102 have a low initial viscosity during compounding, allowing excellent fiber wetting, high fiber volume fraction and efficient processing. The high reactivity of the hardener allows fast curing in about3 min at 150 °C.
VESTANAT® EP-EF 201
VESTANAT® EP-EF 201 is a ready catalyzed polyethoxysilane. It is used as a crosslinker or sole binder to formulate highly scratch- and chemical resistant coatings, e. g. highly scratch resistant NISO*2coatings. The crosslinker is appropriate for the use in "do-it-yourself" (DIY) applications.
VESTANAT® EP-IPMS
VESTANAT® EP-IPMS is an isocyanate building block for the preparation of silane modified urethane resins. These resins may be used for the production of isocyanate-free, moisture curing adhesives, sealants and weatherable, UV- and scratch-resistant coatings.
VESTANAT® EP-M 222 X
VESTANAT® EP-M 222 X is a methoxysilane functional urethane crosslinker that can be used as a crosslinker to increase the flexibility of highly scratch resistant coatings, e.g. highly scratch resistant NISO*2 coatings. It is dissolved at 85 % in xylene, allowing it to be used in low-VOC coatings formulation.
VESTANAT® EP-M 60
VESTANAT® EP-M 60 is a solvent free, polyfunctional methoxy silane. It is used as a crosslinker toformulate highly scratch resistant coatings.
VESTANAT® EP-MF 203
VESTANAT® EP-MF 203 is a solvent free and ready catalyzed polymethoxysilane. It is used as a crosslinker or sole binder to formulate highly scratch- and chemical resistant coating, e. g. highly scratch resistant NISO*2coatings.
VESTANAT® EP-MF 204
VESTANAT® EP-MF 204 is a solvent free and ready catalyzed polymethoxysilane. It is used as a crosslinker or sole binder to formulate highly scratch- and chemical resistant coating, e. g. highly scratch resistant NISO*2 coatings.
VESTANAT® EP-MF 205
VESTANAT® EP-MF 205 is a solvent-based, ready catalyzed polymethoxysilane. It is used as a crosslinker or sole binder to formulate extremely flexible, highly scratch- and chemical resistant coatings., e.g. highly scratch resistant NISO*2coatings. VESTANAT® EP-MF 205 is particularly characterized by an optimized price/performance ratio and a harmoniously tuned mechanical property profile.
