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Adhesives & Sealants
DYHARD® D50EP is a master batch of 50% DYHARD® 100S in standard bisphenol A epoxy resin (EEW 182-192). Advantages include a dust-free production environment, as well as easier dosage and incorporation. It is cost-effective due to easy handling, and offers the same reactivity, latency, and mechanical properties as the DYHARD® 100 series. This product is recommended for one-component thermosetting epoxy resin formulations for the automotive, sporting goods, and aerospace industry, for adhesives, for encapsulation compounds, and more.
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DYHARD® 100 is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat.
DYHARD® 100S is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat.
DYHARD® 100SF is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat.
DYHARD® 100SH is part of a series that consists of different micronized grades of dicyandiamide curing agents for the formulation of thermosetting epoxy resin compositions. They contain up to 3 % of inert anti-caking agent in order to prevent agglomerations and to improve handling. The products of the DYHARD® 100 series do not react with epoxy resins at moderate temperatures. Dispersed in epoxy resin the mixture remains stable until activated by heat.