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COPONYL™ 5065 ingredient sample

Adhesives & Sealants

COPONYL™ 5065

Nippon Gohsei

COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives.

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